1. 2. 3. material content data sheet sales product name ipd034n06n3 g issued 29. august 2013 ma# MA000505348 package pg-to252-3-11 weight* 393.16 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.184 1.32 1.32 13185 13185 leadframe non noble metal iron 7439-89-6 0.140 0.04 356 inorganic material phosphorus 7723-14-0 0.042 0.01 107 non noble metal copper 7440-50-8 139.706 35.52 35.57 355337 355800 wire non noble metal aluminium 7429-90-5 4.002 1.02 1.02 10178 10178 encapsulation organic material carbon black 1333-86-4 1.417 0.36 3603 plastics epoxy resin - 24.793 6.31 63060 inorganic material silicondioxide 60676-86-0 115.463 29.37 36.04 293678 360341 leadfinish non noble metal tin 7440-31-5 3.740 0.95 0.95 9513 9513 plating non noble metal nickel 7440-02-0 0.091 0.02 231 inorganic material phosphorus 7723-14-0 0.000 0.00 0.02 1 232 solder noble metal silver 7440-22-4 0.099 0.03 253 non noble metal tin 7440-31-5 0.079 0.02 202 non noble metal lead 7439-92-1 3.796 0.97 1.02 9654 10109 heatspreader inorganic material phosphorus 7723-14-0 0.028 0.01 72 non noble metal iron 7439-89-6 0.095 0.02 241 non noble metal copper 7440-50-8 94.488 24.03 24.06 240329 240642 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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